Released on: June 3, 2008, 11:54 pm

Press Release Author: ResearchInChina

Industry: Telecommunications

Press Release Summary: The components of a mobile phone can be divided into four
major categories.

The first category is the active components. The so-called active components, mainly
composed of semiconductor and display, refer to those whose physical and chemical
properties change when electrified. More than 50 percent of the total cost of a
mobile phone comes from semiconductor, production of which is under the control of
European and American companies. The active components include baseband, memory,
application processor, power management, RF and camera module. Baseband can be
classified into analog baseband and digital baseband, the two of which are as usual
integrated and sometimes isolated.

Baseband is the key component of a mobile phone with the highest technical content.
Only a handful of global manufacturers possess the technology, including TI (a major
supplier for Nokia and SonyEricsson), NXP (a key supplier for Samsung), Freescale (a
main supplier for Motorola), Agere (a key supplier for Samsung), MTK (a main
supplier for producers on Mainland China), ADI (a key supplier for LG and Sharp),
Qualcomm (a leader in CDMA baseband with a market share of over 80%), EMP, Infineon,
Broadcom, Skyworks, Toshiba and NEC.

Apart form baseband, memory is the second most expensive semiconductor component. In
the high-priced handset, memory is the most expensive component, whose suppliers
consist of Samsung, Spansion, Intel, Toshiba and STMicroelectronics. RF includes
mainly power amplifier and transceiver, key power amplifier suppliers are composed
of RFMD, Skyworks, Renesas and Freescale, while major transceiver suppliers include
Qualcomm, STMicroelectronics, Infineon, TI, Renesas, Philips, RFMD and Skyworks.

Semiconductor component producers have a high threshold particularly in RF and
analog IC fields with the highest gross profit margins, the global market of which
is controlled by American and European manufacturers. The average gross profit
margin is between 30% and 40%, and the gross profit margin of analog IC reaches 70%,
the highest in the electronic industry. MTK is a recent black horse in the market,
grabbing vigorously handset market on the mainland, and it has got access to the
supply chain of LG. The gross profit margin of MTK is also above 40%.

The second category is the passive components, which refer to the components that do
not have physical and chemical changes when electrified, mainly including capacitor,
inductor and resistor. Capacitor inside a mobile phone is a special MLCC capacitor,
and resistor and inductor are also special chip inductor and chip resistor. The
major suppliers include Murata, TDK, Kyocera, Taiyo Yuden, Panasonic and Rohm from
Japan and Yageo, TA-I, Ralec, Chilisin and Walsin from Taiwan. In the field of
passive components, the Japanese manufacturers dominate the high-end market, while
the Taiwanese counterparts control the low-end market. The Taiwanese producers are
eroding the market of Japanese producers, forcing the latter to continuously upgrade
its technology to develop high-end products. The gross profit margin of Taiwanese
producers remains at about 10%, while that of Japanese manufacturers is at about
15-20%.

The third category is the structure components, which mainly refer to mobile phone
cases and PCB board. Producers of mobile phone outer shell include Green Point,
Perlos, Nalato, Nypro, Foxconn, HI-P, Unikun and Biente, while PCB manufacturers are
composed of Compeq, Unimicron and Unitech from Taiwan, Ibiden, CMK and Multek from
Japan, and Elec&Eltek Group and Elec & Eltek and Ultrasonic Electronics Corp. from
Mainland China.

Mobile phone case sector seems simple but actually it has a very high threshold. In
particular, the design of ultra-thin handset has to consider how to control
electromagnetic radiation, and at present fewer than 15 manufacturers in the world
could do it. The gross profit margin of mobile phone case producers is 20% or so.
Yet, the market is highly concentrated, with Perlos currently ranking the first in
the world.

PCB market is monopolized by manufacturers from Taiwan and Japan. The high-end
market is dominated by the Japanese producers, while the Taiwanese counterparts
control low-end market. However, the Taiwanese producers have made much progress in
recent years and their PCB production accounts for around 40% of the global total.
PCB sector is experiencing a recovery and its gross profit margin is about 10%.

The fourth category refers to the functional components like electro-acoustic
component, vibrating motor, display, battery and antenna. Display is a component
taking up a very big proportion to the total cost of a mobile phone. Display has two
working procedures, the first of which is to produce a panel, and the second is to
make the panel into a module. Most the manufacturers on Mainland China are the
module producers, while panel manufacturers include AUO and Wintek from Taiwan,
Samsung and Samsung SDI from South Korea, and Kyocera, Sharp, Epson Sanyo,
Toshiba-Panasonic Display, and Sony-Toyota ST-LCD from Japan. With the addition of
many new production lines, the prices of display have dropped sharply and the gross
profit margin of producers has declined to about 10%.

Acoustic component producers consist of Panasonic Electronic Devices, Hosiden,
Cookson, Foster Electric, Merry, Philips, Mayloon, Kingsate Electronics, Xuanwei,
Knowles Acoustics, Yuanyu Electronic, Shenzhen Linjia Electroacoustic, Hangzhou
Shengyuan Electronics, Ningbo Xiangyang Group and Zhejiang Tianle Group. Its gross
profit margin is relatively low. For instance, the gross profit margin of Merry, the
largest producer of acoustic component in Taiwan province, was less than 7% in the
third quarter of 2006. Battery manufacturers are composed of BYD, SCUD, Sanyo
Energy, Sony Chemical and TCL Hyperpower Batteries Inc. The battery market has the
highest degree of concentration. The Japanese manufacturers rely on its advanced
technology and the production lines valued at JPY1 billion, while the Chinese
counterparts exchange its cost-effective labor force for expensive production lines.
BYD and Sanyo Energy take up more than 50% of the global market share and their
gross profit margin is about 15%.

Press Release Body: Table of Contents

1. Brief Introduction to Mobile Phone Industry Chain
1.1 Brief Introduction to Mobile Phone Components
1.2 Status Quo of Mobile Phone Industry Chain
1.3 Development Trend of Mobile Phone Industry Chain
1.4 Mobile Phone Design and Cost Analysis
1.4.1 IPHONE
1.4.2 Lenovo V800

2. Mobile Phone Platform
2.1 Brief Introduction
2.2 Development Trend of Mobile Phone Baseband
2.2.1 Further Improvement of Integration
2.2.2 Reduction in Development Cost
2.2.3 Multimedia Trend
2.2.4 A Key Factor - Integration and Packaging
2.2.5 Status Quo and Trend of Baseband Industry Development
2.3 Options for Separation or Integration of Baseband and Application Processor Design
2.4 Status Quo of Mobile Phone Platform Industry
2.5 Overview of China Mobile Phone Platform Market
2.6 Major Mobile Phone Platform Manufacturers
2.6.1 Qualcomm
2.6.2 EMP
2.6.3 MTK

3. Mobile Phone RF
3.1 RF Circuit Structure
3.2 RF Semiconductor Process
3.2.1 GaAs
3.2.2 SiGe
3.2.3 RF CMOS
3.2.4 UltraCMOS
3.2.5 Si BiCMOS
3.3 RF Semiconductor in 3G Era
3.4 Status Quo and Trend of Mobile Phone RF Industry Development
3.5 Overview of Global Mobile Phone RF Industry
3.6 RF Manufacturers
3.6.1 SKYWORKS
3.6.2 RFMD

4. Mobile Phone Embedded Memory
4.1 Brief Introduction
4.1.1 Conception
4.1.2 Three Factions of PSRAM
4.1.3 CellularRAM
4.1.4 COSMORAM
4.1.5 UtRAM
4.1.6 Mobile SDRAM
4.1.7 Dispute between NOR and NAND
4.1.8 Future Changes of Mobile Memory and Baseband Framework
4.2 Mobile Phone Memory Market and Industry Status
4.3 Mobile Phone Memory Manufacturers
4.3.1 Intel
4.3.2 SPANSION
4.3.3 ELPIDA
4.3.4 STMicroelectronics

5. Mobile Phone Display Screen
5.1 Development Trend
5.2 Mobile Phone Display Screen Industry
5.3 Major Mobile Phone Display Screen Manufacturers
5.3.1 Samsung
5.3.2 Samsung SDI
5.3.3 Epson
5.3.4 Hitachi
5.3.5 Sharp
5.3.6 Wintek
5.3.7 Toppoly

6. Mobile Phone PCB
6.1 Brief Introduction
6.2 Latest Development of Global PCB Industry
6.3 Mobile Phone PCB Technology
6.3.1 HDI
6.3.2 ALIVH
6.3.3 FVSS
6.3.4 Mobile Phone Rigid-flex PCB
6.4 Mobile Phone PCB Industry
6.4.1 Unimicron
6.4.2 Compeq
6.4.3 AT&S
6.4.4 Meadville

7. Mobile Phone Structure Components & Case
7.1 Materials
7.2 Processing Techniques
7.3 Market
7.4 Industry
7.5 Manufacturers
7.5.1 Green Point
7.5.2 Chicheng
7.5.3 PERLOS

8. Mobile Phone Electroacoustic Components
8.1 Brief Introduction
8.2 MEMS Microphone
8.3 Mobile Phone Electroacoustic Components
8.4 Mobile Phone Electroacoustic Component Industry
8.5 Mobile Phone Electroacoustic Component Manufacturers
8.5.1 Merry
8.5.2 Hosiden

9. Mobile Phone Passive Components
9.1 Brief Introduction
9.2 Development Trend of MLCC
9.3 MLCC Industry Pattern
9.4 Manufacturers
9.4.1 Murata
6.4.2 Yageo
9.4.3 Walsin

10. Mobile Phone Battery
10.1 Brief Introduction
10.1.1 Liquid Li-ion Battery
10.1.2 Polymer Li-ion Battery
10.2 Mobile Phone Battery Industry Pattern
10.3 Mobile Phone Battery Industry Pattern in Mainland China
10.4 Manufacturers
10.4.1 BYD
10.4.2 Samsung SDI
10.4.3 Sanyo Energy
10.4.4 LG Chem

11. Mobile Phone Camera Module
11.1 Brief Introduction
11.2 Lens Manufacturers
11.2.1 Assembly Technology of Mobile Phone Camera Module
11.2.2 Assembly Manufacturers
11.3 Mobile Phone Camera Module Industry and Its Market Development Trend
11.4 CMOS Sensor Manufacturers
11.4.1 OmniVision
11.4.2 Micron
11.4.3 Magnachip
11.5 Mobile Phone Camera Module Lens Manufacturers
11.5.1 Genius
11.5.2 Largan Precision
11.5.3 Asia Optical
11.5.4 Kinko Optical
11.5.5 Enplas

12. Mobile Phone Manufacturers
12.1 Status Quo of Global Mobile Phone Industry
12.2 Status Quo of China Mobile Phone Industry
12.3 Mobile Phone Brand Manufacturers
12.3.1 Samsung
12.3.2 SonyEricsson
12.3.3 Nokia
12.3.4 LG
12.3.5 Motorola
12.3.6 Bird
12.3.7 TCL
12.3.8 Lenovo
12.3.9 Yulong
12.4 OEM and ODM Manufacturers
12.4.1 HTC
12.4.2 Compal
12.4.3 Arima
12.4.4 Foxconn
12.4.5 Flextronics
12.4.6 ELCOTEQ



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